TECHNOLOGY
| Technical Capability (Single Layer) | ||||||||||||
| Base Material | Cem1, Cem3, FR4, Aliminum, Flexible | |||||||||||
| Panel Size | 400*1200 mm | Pcb thickness | 0.8mm -2.4mm | |||||||||
| Copper Thickness | 25 Mic. -105 Mic. | Minimum Hole size | 0.6mm | |||||||||
| Trace Width | 0.20 mm | Min. Hole Tolerance | ± 0.075 mm | |||||||||
| Trace Space | 0.20 mm | Min. Hole position Tol. | ± 0.10 mm | |||||||||
| Plate Warpage | ≤ 0.75 % | Min. Outline Tolerance | ± 0.10 mm | |||||||||
| Solder Mask and Legend Printing | Green, White, Black, Red, Blue | |||||||||||
| Other Applications | Carbon, Peelable | Productin Standard R. | IPC -A-600 C.II-III | |||||||||
| Surface Finish | OSP, ENIG, HASL, ROLLER TINNING, LEAD FREE | |||||||||||
| Mechanical Process | CNC, PUNCHING, V-CUT | |||||||||||
| Technical Capability (2 Layer & Multi Layer) | ||||||||||||
| Base Material | FR4, High TG FR4, Hologen free FR4 | |||||||||||
| Panel Size | 540*620 mm | PCB thickness | 0.4mm -2.4mm | |||||||||
| Copper Thickness | 18 Mic. -140 Mic. | Minimum Hole size | 0.2mm | |||||||||
| Trace Width | 0.10 mm | Min. Hole Tolerance | ± 0.075 mm | |||||||||
| Trace Space | 0.10 mm | Min. Hole position Tol. | ± 0.075 mm | |||||||||
| Impedance Tolerance | ≤ 0.75 % | Inner Copper Thickness | 25um | |||||||||
| Plate Warpage | ≤ 0.75 % | Min. Outline Tolerance | ± 0.10 mm | |||||||||
| Solder Mask and Legend Printing | Green, White, Black, Red, Blue | |||||||||||
| Other Applications | Carbon, Peelable | Productin Standard R. | IPC -A-600 C.II-III | |||||||||
| Surface Finish | OSP, ENIG, HAL, HASL, LEAD FREE | |||||||||||
| Mechanical Process | CNC, PUNCHING, V-CUT | |||||||||||
